Electronic Components│Packaging Forms and Application Scenarios

　　PGA (Pin Grid Array)

　　Application Scenario: Communication, Artificial Intelligence, Data Centre, Military Aerospace.

　　PLCC(Plastic Leaded Chip Carrier)

　　Application Scenario: Wide range of electronic equipment and circuit board applications, including computers, communication equipment, consumer electronics.

　　PQFP(Plastic Quad Flat Package)

　　Application Scenario: SMT surface mount technology on the PCB mounting wiring.

　　SOT(Small Outline Transistor)

　　Application Scenario: Small power semiconductor devices, such as transistors, diodes and small integrated circuits.

　　SSOP (Shrink Small-Outline Package)

　　Application Scenario: IC package performance needs to be optimised, while compressing the package size and reducing the pin pitch.

　　TO Package (Transistor Outline)

　　Application Scenario: Power electronic devices including amplifiers, switches, voltage regulators, power converters.