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SAMSUNG


SAMSUNG 

The advancement of supercomputing and AI-based technologies require the highest caliber of memory that can meet industry needs for bandwidth, capacity, and efficiency. HBM2E Flashbolt can boost the power of AI, handle more Big Data through its expanded capacity, and provide high-bandwidth.

HBM2

HBM3


Core offer HBM lead time 4-6weeks .

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SAMSUNG

HBM3

Part NumberDensityPackageSpeedRefreshOrganization
KHBA84A03D-MC1H16 GBMPGA6.4 Gbps32 ms1024
KHBA84A03C-MC1H16 GBMPGA6.4 Gbps32 ms1024
KHBAC4A03D-MC1H24 GBMPGA6.4 Gbps32 ms1024
KHBAC4A03C-MC1H24 GBMPGA6.4 Gbps32 ms1024


HBM3E

Part NumberDensityPackageSpeedRefreshOrganization
KHBBC4B03C-MC1K36 GBMPGA9.2 Gbps32 ms1024
KHBA84A03D-MC1H16 GBMPGA6.4 Gbps32 ms1024
KHBAC4A03D-MC1H24 GBMPGA6.4 Gbps32 ms1024
KHBB84A03B-MC1J24 GBMPGA8.6 Gbps32 ms1024
KHBA84A03C-MC1H16 GBMPGA6.4 Gbps32 ms1024
KHBAC4A03C-MC1H24 GBMPGA6.4 Gbps32 ms1024


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